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SILICON CARBIDE DIODE HAVING HIGH SURGE CURRENT CAPABILITY AND MANUFACTURING METHOD THEREOF

机译:具有高浪涌电流能力的碳化硅二极管及其制造方法

摘要

A silicon carbide diode having high surge current capability and a manufacturing method therefor, belonging to the technical field of semiconductor device manufacturing. The silicon carbide diode comprises a semiconductor substrate. The semiconductor substrate comprises an N-type silicon carbide substrate (2) and an N-type silicon carbide epitaxial layer (3) located on the N-type silicon carbide substrate (2). A plurality of P-type well regions (6) are disposed at an upper portion inside the N-type silicon carbide epitaxial layer (3). An N-type high-resistance region (4) is disposed below or at a lower surface of the P-type well regions (6). The N-type high-resistance region (4) has a resistivity greater than that of the N-type silicon carbide epitaxial layer (3). The N-type high-resistance region (4) is disposed below the P-type well regions (6) and a plurality of grooves (5) are provided in the P-type well regions (6), or a plurality of evenly spaced block-shaped P-type regions (12) are provided in the N-type high-resistance region (4), so as to increase the surge current capability of the device under normal conduction working conditions.
机译:具有高浪涌电流能力的碳化硅二极管及其制造方法,属于半导体器件制造技术领域。碳化硅二极管包括半导体衬底。半导体衬底包括N型碳化硅衬底(2)和位于N型碳化硅衬底(2)上的N型碳化硅外延层(3)。在N型碳化硅外延层(3)内部的上部布置有多个P型阱区域(6)。 N型高电阻区域(4)设置在P型阱区域(6)的下方或下表面。 N型高电阻区域(4)的电阻率大于N型碳化硅外延层(3)的电阻率。 N型高电阻区域(4)设置在P型阱区域(6)的下方,并且在P型阱区域(6)中设置有多个凹槽(5),或者多个均匀间隔开的凹槽。在N型高阻区(4)中设置有块状的P型区(12),以增加在正常导通工作条件下器件的浪涌电流能力。

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