MULTILAYER STRUCTURE WITH EMBEDDED SENSING FUNCTIONALITIES AND RELATED METHOD OF MANUFACTURE

摘要

Integrated multilayer structure suitable for use in sensing applications is presented. The multilayer structure comprises at least one plastic layer (104), at least one film (102, 102B) layer provided on both sides of the plastic layer, said film layer (102) on a first side of the plastic layer comprising electronics (103, 110, 112, 114, 116, 305, 404, 405, 505, 06, 508, 510, 606, 606B, 608, 706, 708, 1010, 1012) incorporating reactance sensing electronics for sensing of selected target quantities, and conversion thereof into representative electrical signals. Said sensing electronics comprise an electrode and a connection element for connecting the electrode to a control circuitry, and said film layer (102B) on a second side of the plastic layer comprising features (105, 118, 120, 124, 126, 128, 306, 408, 512, 606C, 608C, 710, 810, 1002) including one conductive feature, said features being configured to adapt the sensing response of the sensing electronics on the first side of the plastic layer.