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ADVANCED SEMICONDUCTOR PROCESS OPTIMIZATION AND ADAPTIVE CONTROL DURING MANUFACTURING
ADVANCED SEMICONDUCTOR PROCESS OPTIMIZATION AND ADAPTIVE CONTROL DURING MANUFACTURING
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机译:制造过程中的高级半导体工艺优化和自适应控制
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摘要
A spatial model is built to predict performance of a processing chamber. The spatial model is used to converge faster to a desired process during the process development phase. A system for controlling device performance variability during manufacturing includes a process platform, on-board metrology (OBM) tools, and a machine-learning based process control model. The system receives SEM metrology data, and updates the process control model periodically (e.g., wafer-to-wafer, lot-to-lot, chamber-to-chamber etc.) using machine learning techniques. Periodic update of the process control model may account for chamber-to-chamber variability.
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