SOLDER PASTE LASER-INDUCED FORWARD TRANSFER DEVICE AND METHOD

摘要

A solder paste laser-induced forward transfer device and method. The device comprises a laser (1), a beam shaping module, an optical path adjustment module, a solder paste transfer module and a computer control system (14), wherein the laser is connected to the beam shaping module, followed by the optical path adjustment module; the solder paste transfer module is located below the optical path adjustment module; the beam shaping module comprises a beam expansion lens (2), an aperture (3), a flat-top beam shaper (4) and a spatial light modulator (5); the optical path adjustment module comprises a two-dimensional galvanometer (6) and an f-θ lens (7); the solder paste transfer module is composed of a transparent substrate (8), a solder paste film (9), a fixture (10), a Z-axis lifting table (11), a receiving substrate (12), and an XYZ precision moving platform (13); and the computer control system is composed of a computer and drivers of other devices. Non-contact, high-precision solder paste transfer can be achieved without a mask, which can greatly shorten the production cycle and reduce production costs.