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SEMICONDUCTOR DEVICE TEST SYSTEM, SEMICONDUCTOR DEVICE TEST METHOD, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

机译:半导体器件测试系统,半导体器件测试方法和半导体器件制造方法

摘要

According to an embodiment of the present invention, provided is a semiconductor device test system which comprises: a body having an internal space in which a test device is seated; and a cover combined with the body to cover the internal space. The cover includes a first cover including first openings arranged in two dimensions and a second cover including second openings arranged in two dimensions, wherein the arrangement of the first openings is different from the arrangement of the second openings.;COPYRIGHT KIPO 2020
机译:根据本发明的实施例,提供了一种半导体器件测试系统,其包括:主体,该主体具有内部空间,测试装置被安置在该内部空间中;以及以及与主体结合的盖子以覆盖内部空间。盖包括第一盖和第二盖,第一盖包括以二维布置的第一开口,第二盖包括以二维布置的第二开口,其中第一开口的布置与第二开口的布置不同。COPYRIGHTKIPO 2020

著录项

  • 公开/公告号KR20200012211A

    专利类型

  • 公开/公告日2020-02-05

    原文格式PDF

  • 申请/专利权人 SAMSUNG ELECTRONICS CO. LTD.;

    申请/专利号KR20180087209

  • 发明设计人 KIM JUNBAE;CHO YONGHO;

    申请日2018-07-26

  • 分类号G01R31;G01R31/28;

  • 国家 KR

  • 入库时间 2022-08-21 11:08:00

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