Method of Calculating combined model function method of setting lithography apparatus lithography method lithography apparatus

摘要

The present invention relates to a model function calculated by a combined model function calculation method, which can be defined by a weighting function which assigns different weights to each basis of a plurality of model functions. Accordingly, reliable interlayer alignment can be provided even when asymmetry of an alignment mark or an overlay mark has high dependence on the horizontal position on a wafer.