RDL - The double-faced adhesive tape for RDL forming process Laminate containing the same and Manufacturing process of Fan-out package

摘要

The present invention relates to a double-sided adhesive tape and, more specifically, to a double-sided adhesive tape, which is used to bond / de-bond a carrier wafer and a device wafer for a redistribution layer (RDL) forming process during a fan-out package manufacturing process. The double-sided adhesive tape for the RDL forming process comprises: a first adhesive layer; a laser degradable film layer; and a second adhesive layer.