APPARATUS FOR ELECTRO-FORMING AND APPARATUS FOR HORIZONTAL ELECTRO-FORMING

摘要

The electroplating apparatus according to the embodiment of the present specification is a plating bath, which is a space in which a substrate is plated, a clamp for holding a substrate disposed in the plating tank and disposed in a horizontal direction, and spaced apart from an upper portion of the substrate, with an external power source. The connected anode and the substrate are spaced apart from each other, and a combination including a plating solution supply unit for supplying a plating solution, a driving unit spaced apart from the substrate and reciprocated in a horizontal direction, and the combination includes an insulator between the anode and the plating solution supply unit , It is possible to provide a plated film having a constant thickness.