Zero misalignment two-via structure using optical imageable dielectric, build-up film, and electrolytic plating

摘要

A device package and a method of forming a device package are described. The device package includes a dielectric on a conductive pad and a first via on a first seed on a top surface of the conductive pad. The device package includes a conductive trace on a dielectric and a second via on a second seed layer on the dielectric. The conductive trace is connected to the first via and the second via, and the second via is connected to the edge of the conductive trace opposite the first via. The dielectric may comprise a light imageable dielectric or build-up film. The device package may also include a seed on the dielectric prior to the conductive trace on the dielectric, a dielectric, a conductive trace, and a second dielectric on the first and second vias, the second dielectric exposing the top surface of the second via. .