Integrated circuit chip method of manufacturing integrated circuit chip and integrated circuit package and display apparatus including integrated circuit chip

摘要

The integrated circuit chip includes a via contact plug extending in a vertical direction within a through hole penetrating a substrate and a device layer formed on the substrate, a via contact liner surrounding the via contact plug, and integrally connected to the via contact liner And a connection pad liner extending in a horizontal direction along a rear surface of the substrate, a dummy bump structure integrally connected to the via contact plug, and a bump structure connected to the connection pad liner. In a method of manufacturing an integrated circuit chip, a first connection metal layer is formed inside and outside the through hole, and covers the UBM layer in the through hole, and a second connection metal layer integrally connected to the first connection metal layer. And a third connection metal layer covering the UBM layer on the connection pad liner.