HIGH POWER LASER MODULE MANUFACTURING METHOD USING LASER SOLDERING BONDING TECHNIQUE

摘要

An object of the present invention is to improve the work efficiency of matching the solder pattern and alignment of the CuW submount and the ceramic submount by applying a soldering bonding process using a laser beam when manufacturing a high-power CW or QCW laser diode module, and by performing bonding. It is intended to reduce thermal stress generated when manufacturing high-power CW or QCW laser diode modules. According to the present invention, a high-power QCW laser diode module was fabricated by applying a laser beam soldering method to secure electro-optical characteristics.