首页> 外国专利> Laser array chip, laser module, manufacturing method for manufacturing laser module, manufacturing method for manufacturing laser light source, laser light source, illumination device, monitor, and projector

Laser array chip, laser module, manufacturing method for manufacturing laser module, manufacturing method for manufacturing laser light source, laser light source, illumination device, monitor, and projector

机译:激光阵列芯片,激光模块,用于制造激光模块的制造方法,用于制造激光光源的制造方法,激光光源,照明装置,监视器和投影仪

摘要

A laser array chip includes: a plurality of emission sections emitting laser lights; and a weak section formed in a portion in the thickness direction of at least a portion of the areas between the emission sections, whose strength is weaker than the strength of areas in which the emission sections are formed.
机译:激光阵列芯片包括:多个发射部,其发射激光。薄壁部的强度比形成有发光部的区域的强度弱,该薄壁部形成在发光部之间的至少一部分区域的厚度方向的一部分上。

著录项

  • 公开/公告号US2008232419A1

    专利类型

  • 公开/公告日2008-09-25

    原文格式PDF

  • 申请/专利权人 AKIRA EGAWA;KUNIHIKO TAKAGI;

    申请/专利号US20080076498

  • 发明设计人 AKIRA EGAWA;KUNIHIKO TAKAGI;

    申请日2008-03-19

  • 分类号H01S5/10;H01L33;H01L21/02;

  • 国家 US

  • 入库时间 2022-08-21 20:15:05

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