首页> 外国专利> THERMOSETTING RESIN COMPOSITION FOR FORMING CURED FILM NEGATIVE RADIATION-SENSITIVE RESIN COMPOSITION POSITIVE RADIATION-SENSITIVE RESIN COMPOSITION CURED FILM METHOD FOR FORMING THE SAME SEMICONDUCTOR DEVICE AND DISPLAY DEVICE

THERMOSETTING RESIN COMPOSITION FOR FORMING CURED FILM NEGATIVE RADIATION-SENSITIVE RESIN COMPOSITION POSITIVE RADIATION-SENSITIVE RESIN COMPOSITION CURED FILM METHOD FOR FORMING THE SAME SEMICONDUCTOR DEVICE AND DISPLAY DEVICE

机译:形成膜状负片-辐射-敏感树脂组合物的热固树脂组合物形成相同半导体器件和显示装置的正片状辐射-敏感树脂组合物固化膜的方法

摘要

The present invention, while having excellent surface hardness, can form a cured film capable of satisfactorily satisfying general characteristics such as sensitivity, developing adhesion, chemical resistance, heat resistance, transmittance, and relative dielectric constant, and also has excellent storage stability. It aims at provision of the thermosetting resin composition for formation, a negative radiation sensitive resin composition, and a positive radiation sensitive resin composition. The solution of the present invention is [A1] a structural unit (I) containing at least one member selected from the group consisting of a group represented by the following formula (1) and a group represented by the following formula (2), and a crosslinkable group It is a thermosetting resin composition for forming a cured film containing a polymer having a structural unit (II-1) containing (a1). In addition, the solution means of the present invention, [A2] a structural unit (I) comprising at least one member selected from the group consisting of groups represented by the following formula (1) and the following formula (2), and crosslinking Negative radiation-sensitive resin containing a polymer having a structural unit (II-2) containing a radical (a2), [B] a polymerizable compound having an ethylenically unsaturated bond, and [C] a radiation-sensitive polymerization initiator It is a composition. In addition, the solving means of the present invention, [A3] a structural unit (I) containing at least one member selected from the group consisting of a group represented by the following formula (1) and a group represented by the following formula (2), cyclic It is a positive radiation sensitive resin composition containing a polymer having a structural unit (II-3) containing an ether structure or a cyclic carbonate structure, and an acid generator [G]. In the formula (1), R 1 and R 2 are a hydrogen atom, an alkyl group having 1 to 4 carbon atoms or a fluorinated alkyl group having 1 to 4 carbon atoms. In the formula (2), R 3 and R 4 are a hydrogen atom, a halogen atom, an alkyl group having 1 to 4 carbon atoms or a fluorinated alkyl group having 1 to 4 carbon atoms. It is preferable that the crosslinkable group (a1) is at least one selected from the group consisting of an oxiranyl group and an oxetanyl group.
机译:本发明虽然具有优异的表面硬度,但是可以形成能够令人满意地满足诸如感光度,显影粘合性,耐化学性,耐热性,透射率和相对介电常数的一般特性的固化膜,并且还具有优异的储存稳定性。目的在于提供一种用于形成的热固性树脂组合物,负辐射敏感性树脂组合物和正辐射敏感性树脂组合物。本发明的解决方案是[A1]一种结构单元(I),其包含选自下式(1)表示的基团和下式(2)表示的基团中的至少一种,并且可交联基团是用于形成固化膜的热固性树脂组合物,其包含具有包含(a1)的结构单元(II-1)的聚合物。另外,本发明的解决方案是,[A2]一种结构单元(I),其包含选自下式(1)和下式(2)所示的基团中的至少一种,并进行交联。负性放射线敏感性树脂,其为包含具有包含自由基(a2)的结构单元(II-2)的聚合物的聚合物,[B]具有烯键式不饱和键的聚合性化合物和[C]放射线敏感性聚合引发剂的组合物。 。另外,本发明的解决方案是,[A3]含有选自由下述式(1)表示的基团和下述式(1)表示的基团的组中的至少一种的结构单元(I)。 2),环状的,是对放射线敏感性正性树脂组合物,其含有具有含有醚结构或环状碳酸酯结构的结构单元(II-3)的聚合物和酸产生剂[G]。式(1)中,R 1 和R 2 为氢原子,碳原子数为1〜4的烷基或碳原子数为1〜4的氟化烷基。原子。式(2)中,R 3 和R 4 为氢原子,卤原子,碳原子数为1〜4的烷基或氟代烷基。 1-4个碳原子。可交联基团(a1)优选为选自由氧杂环戊基和氧杂环丁烷基组成的组中的至少一种。

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