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THERMOSETTING RESIN COMPOSITION FOR FORMING CURED FILM NEGATIVE RADIATION-SENSITIVE RESIN COMPOSITION POSITIVE RADIATION-SENSITIVE RESIN COMPOSITION CURED FILM METHOD FOR FORMING THE SAME SEMICONDUCTOR DEVICE AND DISPLAY DEVICE
THERMOSETTING RESIN COMPOSITION FOR FORMING CURED FILM NEGATIVE RADIATION-SENSITIVE RESIN COMPOSITION POSITIVE RADIATION-SENSITIVE RESIN COMPOSITION CURED FILM METHOD FOR FORMING THE SAME SEMICONDUCTOR DEVICE AND DISPLAY DEVICE
The present invention, while having excellent surface hardness, can form a cured film capable of satisfactorily satisfying general characteristics such as sensitivity, developing adhesion, chemical resistance, heat resistance, transmittance, and relative dielectric constant, and also has excellent storage stability. It aims at provision of the thermosetting resin composition for formation, a negative radiation sensitive resin composition, and a positive radiation sensitive resin composition. The solution of the present invention is [A1] a structural unit (I) containing at least one member selected from the group consisting of a group represented by the following formula (1) and a group represented by the following formula (2), and a crosslinkable group It is a thermosetting resin composition for forming a cured film containing a polymer having a structural unit (II-1) containing (a1). In addition, the solution means of the present invention, [A2] a structural unit (I) comprising at least one member selected from the group consisting of groups represented by the following formula (1) and the following formula (2), and crosslinking Negative radiation-sensitive resin containing a polymer having a structural unit (II-2) containing a radical (a2), [B] a polymerizable compound having an ethylenically unsaturated bond, and [C] a radiation-sensitive polymerization initiator It is a composition. In addition, the solving means of the present invention, [A3] a structural unit (I) containing at least one member selected from the group consisting of a group represented by the following formula (1) and a group represented by the following formula (2), cyclic It is a positive radiation sensitive resin composition containing a polymer having a structural unit (II-3) containing an ether structure or a cyclic carbonate structure, and an acid generator [G]. In the formula (1), R 1 and R 2 are a hydrogen atom, an alkyl group having 1 to 4 carbon atoms or a fluorinated alkyl group having 1 to 4 carbon atoms. In the formula (2), R 3 and R 4 are a hydrogen atom, a halogen atom, an alkyl group having 1 to 4 carbon atoms or a fluorinated alkyl group having 1 to 4 carbon atoms. It is preferable that the crosslinkable group (a1) is at least one selected from the group consisting of an oxiranyl group and an oxetanyl group.
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