According to the present invention, a cured film, which has excellent hardness of the surface and has descent common properties such as sensitivity, development tightness, chemical resistance, heat resistance, transmittance, and a relative dielectric constant, can be formed. The present invention aims to provide: a thermosetting resin composition for forming a cured film having excellent storage stability; a negative radiation-sensitive resin composition; and a positive radiation-sensitive resin composition. The resin composition for forming a cured film includes a copolymer. The copolymer includes: a structure unit (I) including at least one selected from the group consisting of a group represented by chemical formula (1) and a group represented by chemical formula (2); and a structure unit including a cross-linking group (a1) represented by chemical formula (2).;COPYRIGHT KIPO 2015
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