Provided is an antenna apparatus providing a one-dimensional electromagnetic bandgap grounding structure. The antenna apparatus includes a substrate, a ground layer at least partially formed on the substrate, and a planar inverted-L-type radiator (ILA) disposed on one side of the ground layer. The one-dimensional electromagnetic bandgap grounding structure is mounted at the edge of the planar radiator side of the ground layer. Accordingly, the one-dimensional electromagnetic bandgap grounding structure can be integrated into the ILA and a high-performance single antenna device in a small space without an additional circuit due to a high-impedance surface characteristic exhibiting a low-speed wave behavior in a dual direction. In addition, the antenna apparatus can be utilized in a small array antenna based on platforms of various materials characterized by wide bandwidth, high gain, and a wide scan angle.
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