COPPER FOIL FOR FLEXIBLE PRINTED SUBSTRATE AND COPPER CLAD LAMINATE USING THE SAME FLEXIBLE PRINTED SUBSTRATE AND ELECTRONIC EQUIPMENT

摘要

A copper foil for flexible printed circuit boards having an improved etching rate, a copper clad laminate using the same, a flexible printed circuit board, and an electronic device are provided. It is a rolled copper foil which contains 99.9 mass% or more of Cu, any or both of 0.0005 to 0.0300 mass% P and 0.0005 to 0.2500 mass% Mg as an additive element, and remains unavoidable impurities, and has a conductivity of 80% or more And the copper foil for a flexible printed circuit board having a total length of 600 µm or more when the surface of the copper foil is observed in a field of view of 25 µm x 25 µm.