COPPER FOIL FOR FLEXIBLE PRINTED SUBSTRATE, COPPER-CLAD LAMINATE USING THE SAME, FLEXIBLE PRINTED SUBSTRATE, AND ELECTRONIC EQUIPMENT

摘要

The copper foil for flexible printed circuit boards which suppressed the wrinkle of the copper foil at the time of laminating|stacking copper foil and resin, the copper clad laminated body using the same, a flexible printed circuit board, and an electronic device are provided. It is a copper foil which contains 99.9 mass % or more of Cu and 0.0005 mass % or more and 0.0220 mass % or less of P, and consists of remainder unavoidable impurities, thickness 0.018 mm or less, and the reduction rate of the tensile strength before and after heat processing at 400 degreeC for 1 second is 10 It is % or less, and the electrical conductivity after heat processing is 80% IACS or more and the tensile strength before heat processing is the copper foil for flexible printed circuit boards which are 180 Mpa or more - less than 320 Mpa.