WAFER PROCESSING DEVICE FOR CONTROLLING SEMICONDUCTOR WAFER SHAPE ULTRA-FLATNESS

摘要

The present invention is to provide an ultra-flattened shape-controlled wafer processing apparatus for minimizing warpage or contact area during transfer of a wafer in which IC chips are arranged. The present invention is a polishing pad 11 is attached to the upper surface, the rotating platen (10); And a polishing head 20 having at least one device on the upper side of the polishing pad 11 and rotating while applying pressure to support a silicon wafer and contact the surface of the polishing pad 11, wherein the polishing The head 20 moves the position so that the rotation center of the silicon wafer moves reciprocally from the surface of the polishing pad 11 to the edge, and the groove H recessed in the center of the surface of the silicon wafer It provides a carrier wafer processing apparatus for semiconductor manufacturing to form a carrier wafer (CW) forming a. The present invention can stably and efficiently process the carrier wafer for preventing warpage and minimizing the contact area during transfer of the wafer where the IC chip is arranged.