首页> 外国专利> FPCB FPCBMANUFACTURING METHOD OF FPCB FOR ANTENNA WITH OUTERMOST EXPANSION PATTERN LAYER AND FPCB MANUFACTURED BY THIS

FPCB FPCBMANUFACTURING METHOD OF FPCB FOR ANTENNA WITH OUTERMOST EXPANSION PATTERN LAYER AND FPCB MANUFACTURED BY THIS

机译:FPCB FPCB的制造方法,该FPCB用于具有外扩展图案层的天线的FPCB及其制造的FPCB

摘要

The present invention relates to a method of manufacturing an antenna FPCB having an outermost extended pattern layer. More specifically, in order to provide an outermost extended pattern layer, the copper foil is exposed to the outermost and the exposed copper foil is protected. The present invention relates to a method of manufacturing an FPCB for an antenna having an outermost extension pattern layer punched by plating nickel and gold on an upper portion of the outer edge. To this end, the present invention includes a hot press step of attaching an insulator to a copper clad laminate (CCL) except for the end of the copper foil having an exposed portion to the outermost portion; A plating step of sequentially attaching nickel and gold to an end of a copper foil having an exposed portion up to the outermost portion and plating so that gold is exposed to the outermost portion in the outer punching step; And an external punching step of cutting the copper foil, nickel, and gold of the copper clad laminate to expose the outermost portion.
机译:本发明涉及一种具有最外层延伸图案层的天线FPCB的制造方法。更具体地,为了提供最外层延伸的图案层,将铜箔暴露于最外层并保护暴露的铜箔。本发明涉及一种用于天线的FPCB的制造方法,该FPCB具有通过在外边缘的上部上镀镍和金而冲压的最外延伸图案层。为此,本发明包括热压步骤,将绝缘体附着到覆铜箔层压板(CCL)上,除了铜箔的末端具有暴露于最外层的部分之外。电镀步骤,依次将镍和金附着到铜箔的一端,该铜箔的露出部分一直到最外层,然后进行电镀,以使金在外打孔步骤中露出到最外层。并进行外部冲压步骤,以切割覆铜层压板的铜箔,镍和金,以露出最外面的部分。

著录项

  • 公开/公告号KR102149731B1

    专利类型

  • 公开/公告日2020-08-31

    原文格式PDF

  • 申请/专利权人 GALTRONICS KOREA CO. LTD.;

    申请/专利号KR20190094320

  • 发明设计人 김정수;황재연;김수현;

    申请日2019-08-02

  • 分类号H05K3/18;H01Q1/38;H05K3;H05K3/28;

  • 国家 KR

  • 入库时间 2022-08-21 11:03:57

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