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Apparatus for vacuum processing of substrates, system for vacuum processing of substrates, and method for transport of substrate carriers and mask carriers in vacuum chambers

机译:用于基板的真空处理的设备,用于基板的真空处理的系统以及在真空室中传送基板载体和掩模载体的方法

摘要

The present disclosure provides an apparatus 200 for vacuum processing of a substrate 10. The apparatus 200 includes a vacuum chamber, a first track arrangement 110 configured for transport of the substrate carrier 120, a second track arrangement 130 configured for transport of the mask carrier 140, and a substrate carrier 120. ) And a holding arrangement configured to position the mask carrier 140 relative to each other. The first track arrangement 110 includes a first portion configured to support the substrate carrier 120 at the first end 12 of the substrate 10 and opposite the first end 12 of the substrate 10, the substrate And a second portion configured to support the substrate carrier 120 at the second end 14 of 10. The second track arrangement 120 comprises an additional first portion configured to support the mask carrier 140 at the first end 22 of the mask 20 and opposite the first end 22 of the mask 20, It includes an additional second portion configured to support the mask carrier 140 at the second end 24 of the mask 20. A first distance (D) between a first portion and a second portion of the first track arrangement 110 and a second distance (D') between an additional first portion and an additional second portion of the second track arrangement 130 Are essentially the same.
机译:本公开提供了一种用于对基板10进行真空处理的设备200。该设备200包括真空室,配置为用于运输基板载体120的第一轨道装置110,配置为用于运输掩模载体140的第二轨道装置130。以及保持装置,该保持装置被配置为将掩模载体140相对于彼此定位。第一轨道装置110包括配置为在基板10的第一端12处支撑基板载体120并且与基板10的第一端12相对的第一部分,基板以及配置为在基板10的第一端12处支撑基板载体120的第二部分。第二轨道装置120包括第二部分。第二轨道装置120包括另外的第一部分,该另外的第一部分构造成在掩模20的第一端22处并且与掩模20的第一端22相对地支撑掩模载体140。它包括另外的第二部分。被配置为在掩模20的第二端24处支撑掩模载体140。第一轨道装置110的第一部分和第二部分之间的第一距离(D)以及另外的第一部分之间的第二距离(D')。第二轨道装置130的另一第二部分与第二轨道装置130的第二部分基本相同。

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