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AVALANCHE PHOTODETECTOR (EMBODIMENTS) AND METHOD OF MANUFACTURING THEREOF (EMBODIMENTS)

机译:雪崩光电检测器(实施例)及其制造方法(实施例)

摘要

FIELD: physics.;SUBSTANCE: inventions relate to avalanche photodetectors (APD) - high-speed, high-sensitivity devices widely used in lidars, communication systems, technical vision, robotics, in medicine and biology in environmental monitoring, and so forth. Proposed is an avalanche photodetector manufacturing method involving the following operations: a multiplication layer is formed on the entire surface of the semiconductor substrate; on the surface of the multiplication layer, the closed groove is etched to a depth equal to or greater than the thickness of the multiplication layer, but less than the total thickness of the substrate and the multiplication layer, to form a photodetector inside it; filling the closed groove with heavily doped polycrystalline silicon with the same conductivity type as the multiplication layer; on the part of the upper surface of the multiplication layer limited by said closed groove, a contact layer of at least one avalanche amplifier is formed, forming a region of the photoconverter outside said contact layer; first transparent electrode is formed on contact layer; on lower surface of semiconductor substrate second electrode is formed. Invention also discloses two versions of method for making APD and APD made by said methods.;EFFECT: inventions allow improving main characteristic of avalanche photodetector - its threshold sensitivity.;15 cl, 22 dwg
机译:技术领域本发明涉及雪崩光电探测器(APD)-高速,高灵敏度的设备,广泛用于激光雷达,通信系统,技术视觉,机器人技术,医学和生物学以及环境监测等领域。提出了一种雪崩光电探测器的制造方法,其涉及以下操作:在半导体基板的整个表面上形成倍增层;在倍增层的表面上,将闭合凹槽蚀刻至等于或大于倍增层的厚度但小于基板和倍增层的总厚度的深度,以在其内部形成光电探测器;用与所述倍增层相同的导电类型的重掺杂多晶硅填充所述闭合凹槽;在倍增层的上表面的由所述封闭凹槽限定的部分上,形成至少一个雪崩放大器的接触层,从而在所述接触层的外侧形成光电转换器的区域。在接触层上形成第一透明电极。在半导体衬底的下表面上形成第二电极。本发明还公开了两种制造APD的方法和通过所述方法制造的APD。效果:发明允许改善雪崩光电检测器的主要特性-其阈值灵敏度。15cl,22dwg

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