An interconnection package integrates a photonics die, an electronics die and a switch ASIC into one package. At least some of the components in the electronics die, such as the serializer / deserializer circuits, transceivers, timing circuitry and / or control circuitry, are integrated into the switch ASIC to form an integrated switch ASIC. The photonics die is attached to the integrated switch ASIC and electrically connected to it.
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