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Printed circuit board with protection against electromagnetic interference

机译:印刷电路板具有电磁干扰防护

摘要

Printed circuit board with protection against electromagnetic interference, comprising a shield housing (1) and a circuit board body (2) which is arranged in an inner center of the shield housing, a lower end of the circuit board body being connected to an inner wall of the shield housing by heat dissipation rods (3), an input terminal (4) is connected to the circuit board body through a left end face of the shield case and an output port (5) is connected to the circuit board body through a right end face of the shield case; wherein the circuit board body includes a first through hole (21), a second through hole (22) and a chip portion (23) between the first through hole and the second through hole; a side wall of the first through hole near the second through hole, a periphery of the chip portion, and a side wall of the second through hole near the first through hole are circumferentially coated with a conductive layer (24); a side wall of the first through hole remote from the second through hole and a left side of the circuit board body are circumferentially coated with a first insulating layer (25); and a side wall of the second through hole remote from the first through hole and a right side of the circuit board body are circumferentially coated with a first insulating layer; wherein electronic chips (6) are respectively arranged at an upper end of the first through hole and an upper end of the second through hole and contact welding shields (7) are respectively arranged at a lower end of the first through hole and a lower end of the second through hole; wherein outer sides of the conductive layer are coated with a second upper insulating layer (8) between the two electronic chips and a second lower insulating layer (9) between the two contact welding shields; and wherein the inner wall of the shielding housing is coated with a layer (11) protecting against electromagnetic interference and a third insulating layer (12) and the layer protecting against electromagnetic interference is arranged between the third insulating layer and the inner wall of the shielding housing.
机译:具有电磁干扰防护的印刷电路板,包括屏蔽罩(1)和布置在屏蔽罩的内部中心的电路板主体(2),电路板主体的下端连接到内壁通过散热棒(3)将屏蔽罩的一部分,输入端子(4)通过屏蔽壳的左端面连接到电路板主体,而输出端口(5)通过散热壳(3)连接到电路板主体。屏蔽盒的右端面;其中,电路板主体包括第一通孔(21),第二通孔(22)以及位于第一通孔和第二通孔之间的芯片部分(23)。第一通孔的靠近第二通孔的侧壁,芯片部分的外围以及第二通孔的靠近第一通孔的侧壁在圆周上涂覆有导电层(24);第一通孔的远离第二通孔的侧壁和电路板主体的左侧在周向上涂覆有第一绝缘层(25)。第二通孔的远离第一通孔的侧壁和电路板本体的右侧周向覆盖有第一绝缘层。其中,在第一通孔的上端和第二通孔的上端分别布置有电子芯片(6),在第一通孔的下端和下端分别布置有接触焊接屏蔽件(7)第二通孔;其中,导电层的外侧在两个电子芯片之间涂有第二上绝缘层(8),在两个接触焊接屏蔽层之间涂有第二下绝缘层(9)。其中屏蔽罩的内壁涂有一层抗电磁干扰的层(11)和一个第三绝缘层(12),并且在第三绝缘层和屏蔽层的内壁之间设置有一层抗电磁干扰的层。住房。

著录项

  • 公开/公告号DE202019105550U1

    专利类型

  • 公开/公告日2020-01-17

    原文格式PDF

  • 申请/专利权人 KUNSHAN OBET ELECTRONIC TECHNOLOGY CO. LTD.;

    申请/专利号DE201920105550U

  • 发明设计人

    申请日2019-06-10

  • 分类号H05K9;H05K7/20;

  • 国家 DE

  • 入库时间 2022-08-21 11:00:57

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