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Modeling electromagnetic interference properties of printed circuit boards

机译:模拟印刷电路板的电磁干扰特性

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The mathematical modeling of a printed circuit board (PCB) for the prediction of its electromagnetic interference (EMI) properties is investigated. Two key aspects examined are crosstalk and the high-frequency voltage developed between the ends of a PCB land (ground drop). The notion of partial inductance as opposed to loop inductance is the key to predicting the high-frequency voltages that are developed between the two ends of a land. Crosstalk predictions are a by-product of the modeling. Experimental results are shown to illustrate the accuracy of the model. A technique for the accurate measurement of the high-frequency voltage developed between two ends of a PCB land is described and explained in terms of partial inductances.
机译:研究了用于预测其电磁干扰(EMI)特性的印刷电路板(PCB)的数学模型。研究的两个关键方面是串扰和PCB焊盘两端之间产生的高频电压(接地压降)。与环路电感相反,部分电感的概念是预测连接盘两端之间产生的高频电压的关键。串扰预测是建模的副产品。实验结果表明了该模型的准确性。描述并解释了一种用于精确测量PCB焊盘两端之间产生的高频电压的技术,并采用了部分电感的方式进行了说明。

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