Particle contamination reduction in wafer dicing process

摘要

A method of dicing a semiconductor wafer is explained.In one example, a method of dicing a wafer having a plurality of integrated circuits includes dicing a wafer to be a plurality of segmented die placed on dicing tape.The method further includes forming a material layer over and over the plurality of singulated dies on the dicing tape.The method further includes extending the dicing tape, while multiple particles are collected on the material layer during the expansion.Diagram