Electronic device housing, method of manufacturing electronic device housing, developed metal resin joint plate, and electronic device

摘要

An electronic device housing (100) of the present invention is a housing for internally accommodating an electronic device, the housing provided with a metal bottom plate (201) and a metal side plate (202(202-1, 202-2, 202-3, and 202-4)) which is folded and integrally connected to the bottom plate (201). At least the bottom plate (201) and the side plate (202) constitute a metal member (M), wherein a thermoplastic resin member (301) is joined to a part of a surface of the metal member (M), which is planar, the metal member (M) is reinforced by the thermoplastic resin member (301), and the thermoplastic resin member (301) is joined to both sides of the planar metal member (M).