ELECTRONIC DEVICE HOUSING, METHOD FOR MANUFACTURING ELECTRONIC DEVICE HOUSING, DEVELOPMENT PLAN-SHAPED METAL RESIN JOINT PLATE, AND ELECTRONIC APPARATUS

摘要

An electronic device housing (100) of the present invention is a housing for internally accommodating an electronic device and is provided with a metal bottom plate (201), and metal side plates (202 (202-1, 202-2, 202-3, and 202-4)) folded and integrally connected to the bottom plate (201), in which, in a metal member (M) formed of at least the bottom plate (201) and the side plate (202), a thermoplastic resin member (301) is joined to a portion of the surface of the plate-shaped metal member (M), the metal member (M) is reinforced by a thermoplastic resin member (301), and the thermoplastic resin member (301) is joined to both surfaces of the plate-shaped metal member (M).