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Electronic device housing, development drawing metal resin joint plate, manufacturing method of electronic device housing and electronic devices

机译:电子设备壳体,显影图金属树脂接合板,电子设备壳体的制造方法及电子设备

摘要

PROBLEM TO BE SOLVED: To provide a housing for an electronic device having an excellent balance of light weight, electromagnetic wave shielding property, heat dissipation characteristic and mechanical strength. SOLUTION: The housing is provided with a plastic bottom plate and a plastic side plate integrally bent and connected to the plastic bottom plate for accommodating an electronic device inside, and the plastic bottom plate and the plastic side plate. At least one selected from the above is a housing for electronic devices, which is a plate in which plastics are joined and integrated on both sides of a mesh metal plate (M). [Selection diagram] Fig. 1
机译:要解决的问题:提供一种用于电子设备的壳体,该壳体具有轻量,电磁波屏蔽性能,散热特性和机械强度之间的优异平衡。 SOLUTION:外壳上有一个塑料底板和一个塑料侧板,它们整体弯曲并连接到塑料底板上,以在内部容纳电子设备;塑料底板和塑料侧板也是如此。从上面选择的至少一个是用于电子设备的外壳,该外壳是在网状金属板(M)的两侧结合并集成有塑料的板。 [选择图]图1

著录项

  • 公开/公告号JP2020136515A

    专利类型

  • 公开/公告日2020-08-31

    原文格式PDF

  • 申请/专利权人 三井化学株式会社;

    申请/专利号JP20190028687

  • 发明设计人 内藤 真哉;

    申请日2019-02-20

  • 分类号H05K5/02;H05K9;B29C45/14;

  • 国家 JP

  • 入库时间 2022-08-21 11:37:19

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