首页>
外国专利>
PROCÉDÉ DE TRAITEMENT D'UNE PIÈCE AU LASER ET UTILISATION DE CELUI-CI DANS LA FABRICATION D'UN DISPOSITIF DE COUPE
PROCÉDÉ DE TRAITEMENT D'UNE PIÈCE AU LASER ET UTILISATION DE CELUI-CI DANS LA FABRICATION D'UN DISPOSITIF DE COUPE
展开▼
展开▼
页面导航
摘要
著录项
相似文献
摘要
A laser cutting method includes a step of determining a material to be removed (120) and dividing the material to be removed (120) into a plurality of material chips (121) so as thereby to organize a machining plan for laser cutting; and, a step of, according to the machining plan for laser cutting, moving a laser along a boundary defining the material to be removed (120) on the workpiece (100) to perform cutting in a first direction and a second direction, such that the material chips (121) can be separated from the workpiece (100) orderly piece by piece so as to form a specific pattern. While in laser cutting, the method removes the material piece by piece. With the laser to remove the material chips (121) through cutting along the boundary, the pattern on the workpiece (100) is thus finished equivalently by the laser. Thereupon, the machining time can be significantly reduced.
展开▼