Halogen-free/phosphorus-free/nitrogen-free flame-retardant resin composition, prepreg containing the same, and metal-clad laminate

摘要

PROBLEM TO BE SOLVED: To provide a halogen-free/phosphorus-free/nitrogen-free flame-retardant resin composition, a prepreg containing the same, and a metal-clad laminate. An epoxy resin (100 parts by weight), boehmite (180 to 250 parts by weight), titanium dioxide (180 to 300 parts by weight), and a curing agent (50 to 170 parts by weight) are included, and the curing agent is a non-phenolic hydroxyl group compound and/or a non-amine. A resin composition that is a base curing agent. The combined use of boehmite and titanium dioxide has HB level flame retardancy without being affected by the reactivity of the finally obtained resin composition, and is halogen-free, phosphorus-free, nitrogen-free, and LED The "poisoning" phenomenon of silica gel when adding molding silica gel to the package can be avoided, and the heat resistance and yellowing resistance can meet the application requirements for LED substrate materials. [Selection diagram] None