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Electrical discharge machining of silicon carbide using brass electrode

机译:使用黄铜电极对碳化硅进行放电加工

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摘要

Siliconized silicon carbide, SiSiC is classified as semiconductor and characterized as high hardness, high thermal conductivity, low thermal expansion and typically low porosity materials. SiSiC normally used under high temperature condition such as for heat exchangers, burners, disc brakes and mechanical seals. Die sinking EDM is a non-conventional machining process and available as an alternative to conventional machining to cut certain form and types of material especially to cut complex shape of high strength material. Brass is typical types of material to be used as electrode in EDM process besides copper, graphite, copper-tungsten and molybdenum. Brass does not resist wear as well as copper or tungsten, but is much easier to machine and can be die-cast or extruded for specialized applications. This study is focused on the parameter analysis for EDM die sinking process on SiSiC. Brass electrode is used for the process. EDM parameters; peak current, voltage, pulse duration and pulse interval are selected as the controllable factors. Their effects on material removal rate, tool wear rate and surface roughness on the process are to be studied. Design of experiment methodology is implemented to design the experiment and analysis of variance, ANOVA will be applied for the result analysis. The mathematical models are developed separately for each of the investigated process performances based from the significant effects on the responses. To ensure the mathematical models are valid, confirmation runs are performed with three different parameters setup. The optimum result of material removal rate, tool wear rate and surface roughness in region of finishing operation of EDM die sinking process are finally determined
机译:碳化硅碳化硅SiSiC被归类为半导体,并且具有高硬度,高导热率,低热膨胀性和典型的低孔隙率材料的特征。 SiSiC通常在高温条件下使用,例如用于热交换器,燃烧器,盘式制动器和机械密封。冲模电火花加工是一种非常规的加工工艺,可作为常规加工的替代方法,用于切割某些形式和类型的材料,尤其是切割高强度材料的复杂形状。黄铜是EDM工艺中用作电极的典型材料,除了铜,石墨,铜钨和钼。黄铜的耐磨性不及铜或钨,但易于加工,可以压铸或挤压成型以用于特殊应用。这项研究的重点是在SiSiC上进行EDM芯片下沉工艺的参数分析。黄铜电极用于该过程。 EDM参数;选择峰值电流,电压,脉冲持续时间和脉冲间隔作为可控因素。研究它们对材料去除率,工具磨损率和表面粗糙度对工艺的影响。进行实验方法的设计以设计实验和方差分析,方差分析将用于结果分析。数学模型是根据对响应的重大影响针对所研究的每种过程性能分别开发的。为确保数学模型有效,使用三个不同的参数设置执行确认运行。最终确定了电火花加工下沉过程的精加工区域材料去除率,工具磨损率和表面粗糙度的最佳结果

著录项

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    Che Mud Muhammed Fadley;

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  • 年度 2013
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  • 正文语种 en
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