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Interplay between Mechanics, Electronics, and Energetics in Atomic-Scale Junctions

机译:原子尺度交界处的力学,电子学和能量学之间的相互作用

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摘要

The physical properties of materials at the nanoscale are controlled to a large extent by their interfaces. While much knowledge has been acquired about the properties of material in the bulk, there are many new and interesting phenomena at the interfaces that remain to be better understood. This is especially true at the scale of their constituent building blocks - atoms and molecules. Studying materials at this intricate level is a necessity at this point in time because electronic devices are rapidly approaching the limits of what was once thought possible, both in terms of their miniaturization as well as our ability to design their behavior. In this thesis I present our explorations of the interplay between mechanical properties, electronic transport and binding energetics of single atomic contacts and single-molecule junctions. Experimentally, we use a customized conducting atomic force microscope (AFM) that simultaneously measures the current and force across atomic-scale junctions. We use this instrument to study single atomic contacts of gold and silver and single-molecule junctions formed in the gap between two gold metallic point contacts, with molecules with a variety of backbones and chemical linker groups. Combined with density functional theory based simulations and analytical modeling, these experiments provide insight into the correlations between mechanics and electronic structure at the atomic level. In carrying out these experimental studies, we repeatedly form and pull apart nanoscale junctions between a metallized AFM cantilever tip and a metal-coated substrate. The force and conductance of the contact are simultaneously measured as each junction evolves through a series of atomic-scale rearrangements and bond rupture events, frequently resulting in single atomic contacts before rupturing completely. The AFM is particularly optimized to achieve high force resolution with stiff probes that are necessary to create and measure forces across atomic-size junctions that are otherwise difficult to fabricate using conventional lithographic techniques. In addition to the instrumentation, we have developed new algorithmic routines to perform statistical analyses of force data, with varying degrees of reliance on the conductance signatures. The key results presented in this thesis include our measurements with gold metallic contacts, through which we are able to rigorously characterize the stiffness and maximum forces sustained by gold single atomic contacts and many different gold-molecule-gold single-molecule junctions. In our experiments with silver metallic contacts we use statistical correlations in conductance to distinguish between pristine and oxygen-contaminated silver single atomic contacts. This allows us to separately obtain mechanical information for each of these structural motifs. The independently measured force data also provides new insights about atomic-scale junctions that are not possible to obtain through conductance measurements alone. Using a systematically designed set of molecules, we are able to demonstrate that quantum interference is not quenched in single-molecule junctions even at room temperature and ambient conditions. We have also been successful in conducting one of the first quantitative measurements of van der Waals forces at the metal-molecule interface at the single-molecule level. Finally, towards the end of this thesis, we present a general analytical framework to quantitatively reconstruct the binding energy curves of atomic-scale junctions directly from experiments, thereby unifying all of our mechanical measurements. I conclude with a summary of the work presented in this thesis, and an outlook for potential future studies that could be guided by this work.
机译:纳米级材料的物理性质在很大程度上受到其界面的控制。尽管已经获得了有关散装材料特性的许多知识,但在界面上仍有许多新奇有趣的现象有待更好地理解。在其组成构造块(原子和分子)的规模上尤其如此。由于电子设备正从微型化以及我们设计其行为的能力方面迅速发展到目前认为可能的极限,因此目前必须在这种复杂的水平上研究材料。在本文中,我提出了对单原子接触和单分子结的机械性能,电子传输和结合能之间相互作用的探索。在实验上,我们使用定制的导电原子力显微镜(AFM),该显微镜同时测量跨原子尺度结的电流和力。我们使用该仪器研究金和银的单原子接触以及在两个金金属点接触之间的间隙中形成的单分子结,该分子具有各种主链和化学连接基团。结合基于密度泛函理论的模拟和分析模型,这些实验可洞悉原子级上的力学与电子结构之间的相关性。在进行这些实验研究时,我们反复在金属化AFM悬臂尖端和金属涂层基底之间形成并拉开纳米级结。当每个结通过一系列原子级重排和键断裂事件演变时,会同时测量接触的力和电导,这经常导致单原子接触,然后完全断裂。原子力显微镜经过特别优化,可通过刚性探针实现高分辨力,而刚性探针对于产生和测量跨原子尺寸结的力是必不可少的,否则使用传统的光刻技术很难制造。除了仪器之外,我们还开发了新的算法例程,可以对电势数据进行统计分析,并且可以不同程度地依赖于电导签名。本文提出的主要结果包括我们对金金属接触的测量,通过这些测量,我们能够严格刻画金单原子接触和许多不同的金-分子-金-单分子连接所承受的刚度和最大力。在银金属触点的实验中,我们使用电导率的统计相关性来区分原始和受氧污染的银单原子触点。这使我们可以分别获取这些结构主题的机械信息。独立测量的力数据还提供了关于原子尺度结的新见解,而仅通过电导测量是不可能获得的。使用一组系统设计的分子,我们能够证明即使在室温和环境条件下,量子干扰也不会在单分子结中猝灭。我们还成功地进行了在单分子水平上金属-分子界面上范德华力的首次定量测量之一。最后,在本文结尾处,我们提出了一个通用的分析框架,可以直接从实验中定量地重建原子级结的结合能曲线,从而统一我们所有的机械测量值。最后,对本文提出的工作进行了总结,并展望了可能由该工作指导的未来研究。

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