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Thermal Stability, Microstructures and Mechanical Properties of Nanostructured/Ultrafine Structured Cu-5vol.Al₂O₃ Nanocomposites Fabricated by High Energy Mechanical Milling and Powder Compact Extrusion

机译:高能机械碾磨和粉末压制成型的纳米结构/超细结构Cu-5vol。%Al 2 O 3纳米复合材料的热稳定性,微观结构和力学性能

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摘要

Ultrafine structured metal matrix nanocomposites (MMNCs) have received much attention due to their attractive engineering applications and scientific interest. On the engineering aspect, ultrafine structured MMNCs have a higher room temperature strength and better high temperature performance due to grain boundary strengthening, nanoparticle strengthening and Zener pinning effects compared to their metal matrices. On the scientific aspect, there is the question of whether the linear superposition of basic strengthening mechanisms, which is applicable to conventional precipitation-hardened alloys, is still valid in evaluating the strength of ultrafine structured MMNCs. In general, there might be a synergistic effect among different strengthening mechanisms when the grain sizes of matrices of MMNCs are reduced down to the submicrometer range. In this thesis, a model system of Cu-5vol.%Al₂O₃ was selected to study with the aim of deepening and reinforcing the understanding of the microstructure/property relationship and contributions of various strengthening mechanisms to the overall strength of ultrafine structured MMNCs. Nanostructured Cu-5vol.%Al₂O₃ nanocomposite powder particles were produced by high energy mechanical milling (HEMM) of a powder mixture of Cu powder and Al₂O₃ nanopowder. The nanocomposite powders were then annealed at 300-600°C for up to 5 h. The powders had a high thermal stability at temperatures up to 600°C. After annealing at 600°C for 5 h, Cu nanograins in the microstructure of the nanocomposite powder particles only grew slightly and the microstructure of the Cu matrix of powder particles was still well within the nanostructure range. The activation energy for the grain growth of the Cu nanograins was determined to be 63.4 kJ/mol, which is much lower than that of coarse grained monolithic Cu and similar to that of nanocrystalline monolithic Cu, and suggests the grain growth behavior is controlled by grain boundary diffusion. The impressive thermal stability of the microstructure of the powder particles is mainly associated with the effect of Al₂O₃ nanoparticles on the grain growth through inhibiting the grain boundary diffusion.Ultrafine structured Cu-5vol.%Al₂O₃ nanocomposite samples were synthesized by powder compact extrusion at 750 and 900°C, and their microstructures and tensile properties were characterized. The microstructural characterization showed that there is no significant difference in the mean Cu grain sizes for both samples but the sample extruded at 900°C has far less Al₂O₃ nanoparticles in comparison to the sample extruded at 750°C. The tensile testing results exhibited that the 900°C extruded sample has a larger strength and higher ductility at fracture as compared to those of the 750°C extruded sample. This shows that the dissolution of Al₂O₃ nanoparticles in the Cu matrix takes place when the powder compact is heated and extruded at 900°C, and the dissolution of the Al₂O₃ nanoparticles leads to superior tensile properties of the sample extruded at 900°C. Further ultrafine structured Cu-5vol.%Al₂O₃ nanocomposite samples were prepared by extrusion of powder compacts of nanostructured Cu-5vol.%Al₂O₃ nanocomposite powder at temperatures ranging from 300 to 900°C. The experimental results showed that Cu grains and the sizes and volume fractions of Al₂O₃ nanoparticles of bulk ultrafine structured Cu-5vol.%Al₂O₃ nanocomposite samples increased with the increase of the extrusion temperature. The average sizes of Cu grains and Al₂O₃ nanoparticles and the volume fraction of Al₂O₃ nanoparticles of the extruded samples increased from 132 nm, 43 nm and 0.75% to 263 nm, 100 nm and 4%, respectively, as the extrusion temperature increased from 300 to 900°C. The increases in the sizes and volume fraction of the Al₂O₃ nanoparticles with the increase of the extrusion temperature were caused by the precipitation of Al₂O₃ nanoparticles during extrusion. The samples extruded at 400°C or lower fractured prematurely without yielding, while the samples extruded at T≥500°C fractured after yielding. The yield strengths and ultimate tensile strengths of such materials changed only slightly with the increase of the extrusion temperature and had values in the range 466-517 and 546-564 MPa. However, the tensile ductility of the extruded samples was proportional to the extrusion temperature and increased from 0.76 to 5.82% with increasing the extrusion temperature from 500 to 900°C. The slight decrease of yield strength and significant increase of the ductility of the consolidated sample with increasing extrusion temperature suggests that the level of interparticle atomic bonding in the consolidated samples increases with increased extrusion temperature. It is speculated that the fracture of the samples extruded at T ≤800°C is associated with the weak bonding of residual interparticle boundaries which have not been transformed into grain boundaries. When the extrusion temperature T ≥800°C, the area of the residual interparticle boundaries may be too small to play any major role in causing the fracture of the consolidated sample. Analysis of the contributions of different strengthening mechanisms demonstrates that grain boundary strengthening makes the largest contribution to the strength of the extruded samples relative to the nanoparticle strengthening and strain hardening and experimentally measured yield strength of the extruded samples can be predicted appropriately by the sum of Peierls stress, grain boundary strengthening, nanoparticle strengthening and strain hardening. The effect of annealing on an ultrafine structured Cu-5vol.%Al₂O₃ nanocomposite sample made by powder compact extrusion at 900°C was investigated by annealing for 1h at different temperatures in the range of 500-900°C. This revealed that Al₂O₃ nanoparticles provided excellent thermal stability to the ultrafine structured Cu-5vol.%Al₂O₃ nanocomposite sample. The microstructure and microhardness of the sample remained stable up to annealing at 800°C for 1 h. High resistance of Al₂O₃ nanoparticles to coarsening was responsible for this high thermal stability. The microhardness increase observed for the sample annealed at 700°C for 1 h came from the precipitation of small Al₂O₃ nanoparticles. On the other hand, the sudden drop in microhardness of the sample annealed at 900°C for 1 h was related to the coarsening of small Al₂O₃ nanoparticles and grain growth of the Cu matrix. This thesis concludes with suggestions for future work that would extend on from the findings presented here.
机译:超细结构的金属基质纳米复合材料(MMNC)由于其有吸引力的工程应用和科学兴趣而受到了广泛的关注。在工程方面,与金属基质相比,超细结构的MMNC由于具有晶界强化,纳米粒子强化和齐纳钉扎效应,因此具有更高的室温强度和更高的高温性能。在科学方面,存在一个问题,即适用于常规沉淀硬化合金的基本强化机制的线性叠加在评估超细结构MMNC的强度方面是否仍然有效。通常,当MMNCs的晶粒尺寸减小到亚微米范围时,不同的强化机制之间可能会产生协同效应。本文以Cu-5vol。%Al 2 O 3为模型模型进行研究,目的是加深和加强对微观结构/性能关系的理解,以及各种强化机制对超细结构MMNCs整体强度的贡献。纳米结构的Cu-5vol。%Al 2 O 3纳米复合粉末颗粒是通过高能机械研磨(HEMM)制得的Cu粉和Al 2 O 3纳米粉的粉末混合物。然后将纳米复合粉末在300-600°C退火5小时。粉末在高达600°C的温度下具有很高的热稳定性。在600℃下退火5小时后,纳米复合粉末颗粒的微观结构中的Cu纳米颗粒仅微幅增长,粉末颗粒的Cu基体的微观结构仍很好地处于纳米结构范围内。测得的铜纳米颗粒晶粒生长的活化能为63.4 kJ / mol,远低于粗粒整体铜的活化能,与纳米晶整体铜的活化能相近,表明晶粒的生长行为受晶粒的控制。边界扩散。粉末颗粒的微观结构具有出色的热稳定性,这主要与Al 2 O 3纳米颗粒通过抑制晶界扩散而对晶粒长大的影响有关。超细结构化的Cu-5vol。%Al 2 O 3纳米复合材料样品是在750℃下通过粉末压缩挤压合成的。 900℃,并表征了它们的微观结构和拉伸性能。显微组织表征表明,两种样品的平均Cu晶粒尺寸均无显着差异,但与在750°C挤压的样品相比,在900°C挤压的样品具有更少的Al 2 O 3纳米颗粒。拉伸试验结果表明,与750℃的挤压样品相比,900℃的挤压样品具有更大的强度和更高的断裂延展性。这表明当将粉末压块在900℃下加热并挤出时,Al 2 O 3纳米颗粒在Cu基体中发生溶解,并且Al 2 O 3纳米颗粒的溶解导致在900℃下挤出的样品具有优异的拉伸性能。通过在300至900℃的温度范围内挤压纳米结构的Cu-5vol。%Al 2 O 3纳米复合粉末的粉末压块来制备另外的超细结构的Cu-5vol。%Al 2 O 3纳米复合样品。实验结果表明,随着挤压温度的升高,块状超细结构Cu-5vol。%Al 2 O 3纳米复合材料样品的Cu晶粒和Al 2 O 3纳米颗粒的尺寸和体积分数增加。随着挤压温度从300℃升高到300℃,挤压样品的Cu晶粒和Al 2 O 3纳米颗粒的平均尺寸以及Al 2 O 3纳米颗粒的体积分数分别从132 nm,43 nm和0.75%增加到263 nm,100 nm和4%。 900℃。 Al 2 O 3纳米粒子的尺寸和体积分数随挤出温度的升高而增加是由于在挤出过程中Al 2 O 3纳米粒子的沉淀所致。在400℃或更低温度下挤出的样品过早断裂而不屈服,而在T≥500℃下挤出的样品在屈服后断裂。这种材料的屈服强度和极限抗拉强度随着挤出温度的升高而仅略有变化,其值在466-517和546-564 MPa范围内。然而,挤出样品的拉伸延展性与挤出温度成正比,并且随着挤出温度从500℃增加到900℃而从0.76%增加到5.82%。随着挤压温度的升高,固结样品的屈服强度略有降低,延展性显着提高,这表明固结样品中的颗粒间原子键合水平随挤压温度的升高而增加。据推测,在T≤800℃下挤出的样品的断裂与残余的颗粒间边界的弱结合有关,所述残余的颗粒间边界尚未转化为晶界。挤出温度T≥800°C时,残留颗粒间边界的面积可能太小,以至于在导致固结样品破裂方面没有发挥任何主要作用。对不同强化机制贡献的分析表明,相对于纳米颗粒强化和应变硬化,晶界强化对挤压样品的强度贡献最大,并且可以通过Peierls的总和适当地预测挤压样品的实验测量屈服强度应力,晶界强化,纳米粒子强化和应变硬化。通过在500-900℃范围内的不同温度下退火1h,研究了退火对在900℃下通过粉末压坯挤出制得的超细结构Cu-5vol。%Al 2 O 3纳米复合材料样品的影响。这表明Al 2 O 3纳米颗粒为超细结构的Cu-5vol。%Al 2 O 3纳米复合材料样品提供了极好的热稳定性。样品的显微组织和显微硬度在800°C退火1h之前都保持稳定。 Al 2 O 3纳米颗粒对粗化的高抵抗力是这种高热稳定性的原因。在700℃下退火1小时后观察到的样品的显微硬度增加是由于小的Al 2 O 3纳米颗粒的沉淀。另一方面,在900℃退火1小时的样品的显微硬度的突然下降与小的Al 2 O 3纳米颗粒的粗化和Cu基体的晶粒生长有关。本文最后提出了对未来工作的建议,这些建议将在此处提出的研究结果的基础上继续发展。

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    Zhou Dengshan;

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  • 年度 2014
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