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Curing kinetics and thermomechanical behaviour of co-anhydride cured aminoglycidyl epoxy resins

机译:共酸酐固化的氨基缩水甘油基环氧树脂的固化动力学和热力学行为

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摘要

Curing behaviour and thermo-mechanical properties of a technical grade of N,N,N’,N’-tetraglycidyl-4,4’-diamino-diphenylmethane (TGDDM-Araldite MY721), cured in the presence of an anhydride hardener mixture consisting of maleic anhydride (MA) and pyromellitic acid dianhydride (PMDA) was studied by calorimetric and dynamic mechanical analysis. Cure kinetics and the influence of varying stoichiometric anhydride to epoxy ratios were evaluated and the apparent activation energy was calculated according to Barrett’s method. High extents of conversion from DSC studies of the MY721-resin were reached after a room temperature cure, without an added catalyst, for 24 hours followed by a post-curing step of 1 hour at 90°C. Ultimate glass transition temperatures for the molar anhydride/epoxy ratio, r=0.8 were close to the decomposition temperature and indications were obtained that the network structure consists of two independent sub-networks. It is suggested that two separate mechanisms contribute to the curing reaction at room temperature. First the tertiary amine structure, intrinsic to aminoglycidyl-resins, may act as an internal catalyst for the anhydride ring opening, and secondly, the unsaturated bond of MA participates in the curing reaction by nucleophilic attack, such as from tertiary amines or carboxylate or alkoxide anions. From a study of a range of different amino-glycidyl resins, this low-temperature curing behaviour is found to be a general phenomenon.
机译:工业级N,N,N',N'-四缩水甘油基-4,4'-二氨基-二苯甲烷(TGDDM-Araldite MY721)的固化行为和热机械性能,在由以下成分组成的酸酐硬化剂混合物的存在下固化通过量热和动态力学分析研究了马来酸酐(MA)和均苯四酸二酐(PMDA)。根据Barrett的方法,评估了固化动力学和化学计量的酸酐与环氧比的变化的影响,并计算了表观活化能。在不添加催化剂的情况下室温固化24小时后,达到了MY721树脂的DSC研究的高转化率,然后在90°C下进行了1小时的后固化步骤。摩尔酸酐/环氧比的最终玻璃化转变温度为r = 0.8,接近分解温度,并且表明该网络结构由两个独立的子网络组成。建议在室温下两个独立的机理促进固化反应。首先,氨基缩水甘油基树脂固有的叔胺结构可以充当酸酐开环的内部催化剂,其次,MA的不饱和键通过亲核攻击(例如来自叔胺或羧酸盐或醇盐的作用)参与固化反应阴离子。通过对各种不同的氨基缩水甘油基树脂的研究,发现这种低温固化行为是普遍现象。

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