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Epitaxial growth of lateral graphene / hexagonal boron nitride heterostructures

机译:横向石墨烯/六方氮化硼异质结构的外延生长

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摘要

With the growing 2D materials family, the combination of the semi-metal graphene, insulator hexagonal boron nitride (h-BN) and semiconducting transition metal dichalcognides open new opportunities in understanding and controlling materials properties. The integration of graphene with h-BN in particular is considered as a promising way to engineer the electrical properties of graphene and implementation of more advanced theoretical ideas such as valleytronics in 2D materials. In this thesis work, lateral graphene and boron nitride heterostructures are synthesized by a sequential epitaxial growth method on nickel films and Ni(111) single crystals. The edges of the BN island act as a seed for graphene growth and atomically sharp graphene / h-BN interfaces with a length exceeding 170 nm could be achieved. This is limited by the size of h-BN seed islands. We also attempted the transfer of the heterostructures onto an insulating substrate by the electrochemical delamination method. While this method worked for transferring graphene grown on Ni foil, it was unsuccessful for the G/h-BN heterostructures. Most likely, the strong interaction between heterostructure and Ni(111) causes this failure. The interaction could be reduced by intercalating the heterostructure with different materials such as Br. Further work on the combination of the transfer techniques with our synthesis method followed by intercalation should make it possible to manufacture and transfer G/h-BN heterostructures onto insulating substrates.
机译:随着2D材料家族的不断壮大,半金属石墨烯,绝缘体六方氮化硼(h-BN)和半导体过渡金属二硫的结合为理解和控制材料性能提供了新的机遇。石墨烯与h-BN的集成尤其被认为是一种工程化石墨烯电学性质和实现更高级的理论思想(例如在2D材料中使用Valleytronics)的有前途的方法。在本文工作中,通过顺序外延生长方法在镍膜和Ni(111)单晶上合成了横向石墨烯和氮化硼异质结构。 BN岛的边缘充当石墨烯生长的种子,并且可以实现长度超过170 nm的原子锐化的石墨烯/ h-BN界面。这受h-BN种子岛的大小限制。我们还尝试通过电化学分层方法将异质结构转移到绝缘基板上。尽管该方法可以转移在Ni箔上生长的石墨烯,但对于G / h-BN异质结构却不成功。最有可能的是,异质结构与Ni(111)之间的强相互作用导致了这种失效。可以通过将异质结构插入不同的材料(例如Br)中来减少相互作用。将转移技术与我们的合成方法相结合,再进行插层的进一步工作,应该可以将G / h-BN异质结构制造和转移到绝缘基板上。

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    Huda Md;

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  • 年度 2016
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