Microelectromechanical systems (MEMS) have been already successfully commercializedudfor around 20 years. The design of novel MEMS sensors currently targets two important features:udsmaller dimensions and higher reliability. As the characteristic size of the mechanical componentsudof the devices decreases, uncertainties in the mechanical and geometrical properties inducedudby the microfabrication process become more and more important. To address these issues,udan on-chip testing device has been proposed to avoid any visual inspection for the read-out.udThe electromechanical responses of ten nominally identical specimens have been recorded, andudexperimental data have shown a significant scattering due to the presence of relevant uncertaintyudsources. To interpret the response of the device, an analytical reduced-order model of the wholeuddevice has been developed. A genetic algorithm has then been adopted to identify features of theudmechanical and geometrical uncertainties in the batch of test structures.
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机译：微机电系统（MEMS）已经成功商业化 ud 20年左右。目前，新型MEMS传感器的设计具有两个重要特征：尺寸更小，可靠性更高。随着装置的机械部件的特征尺寸减小，由微细加工过程引起的机械和几何特性的不确定性变得越来越重要。为了解决这些问题， udan提出了一种片上测试设备，以避免对读数进行任何目视检查。 ud已记录了十个名义上相同的样本的机电响应，并且 udexped实验数据显示出明显的散射。相关不确定性 udsources的存在。为了解释设备的响应，已经开发了整个 uddevice的解析降阶模型。然后，采用遗传算法来识别一批测试结构中力学和几何不确定性的特征。
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