Aluminum nitride ceramics are in high demand in electronic industries as substrate materials for applications requiring high thermal conductivity. Sintering and hot pressing are the most common processing methods used to make dense AlN ceramics. However, all methods of AlN sintering involve high temperatures and long times. Therefore, it is an expensive material. Removing oxygen, as a main impurity of aluminum nitride, by a low cost method in order to achieve dense and high thermal conductivity aluminum nitride ceramics has been pursued for many years. A pressureless infiltration technique at low (650-950°C) temperature was developed to fabricate aluminum nitride-based ceramic matrix composites. The process involves forming a particulate porous compact of non-sintered aluminum nitride and introducing magnesium alloy into the channel network by spontaneous infiltration in a nitrogen atmosphere. Magnesium oxide and spinel phase (MgAl 2 O 4 ) were formed in-situ, when nitrogen gas was used. Densification, thermal properties, and microstructure of the products have been studied. Microstructural, phase, and chemical analysis show that AlN-MgO-MgAl 2 O 4 ceramic composites can be fabricated successfully. Metallic phases were not observed in the samples fabricated at higher than 800°C and electrical conductivity results show that they are insulators. Thermal diffusivity and heat capacity have been measured using nano-flash and differential scanning calorimetry techniques, respectively. Thermal conductivity results are strongly influenced by the residual porosity. Maximum thermal conductivity and density at room temperature were measured to be 95.88 W/m.K and 2.451 g/cm 3 , respectively
展开▼
机译:氮化铝陶瓷在电子工业中作为要求高热导率的应用的基底材料是高需求的。烧结和热压是用于制造致密AlN陶瓷的最常见加工方法。然而,所有AlN烧结方法都涉及高温和长时间。因此,它是昂贵的材料。为了实现致密且高导热率的氮化铝陶瓷,已经通过低成本的方法除去作为氮化铝的主要杂质的氧。开发了一种在低温(650-950°C)下无压渗透的技术,以制造氮化铝基陶瓷基复合材料。该方法包括形成非烧结氮化铝的颗粒状多孔压块,并通过在氮气氛中的自发渗透将镁合金引入通道网络。当使用氮气时,原位形成氧化镁和尖晶石相(MgAl 2 O 4)。已经研究了产品的致密化,热性能和微观结构。显微组织,相和化学分析表明,可以成功制备AlN-MgO-MgAl 2 O 4陶瓷复合材料。在高于800°C的温度下制作的样品中未观察到金属相,电导率结果表明它们是绝缘体。已经分别使用纳米闪蒸和差示扫描量热技术测量了热扩散率和热容量。导热率的结果受残余孔隙率的强烈影响。在室温下测得的最大导热率和密度分别为95.88 W / m.K和2.451 g / cm 3
展开▼