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Study of the kinetics and mechanism of rapid self-assembly in block copolymer thin films during solvo-microwave annealing

机译:溶剂-微波退火过程中嵌段共聚物薄膜快速自组装的动力学和机理研究

摘要

Microwave annealing is an emerging technique for achieving ordered patterns of block copolymer films on substrates. Little is understood about the mechanisms of microphase separation during the microwave annealing process and how it promotes the microphase separation of the blocks. Here, we use controlled power microwave irradiation in the presence of tetrahydrofuran (THF) solvent, to achieve lateral microphase separation in high-χ lamellar-forming poly(styrene-b-lactic acid) PS-b-PLA. A highly ordered line pattern was formed within seconds on silicon, germanium and silicon on insulator (SOI) substrates. In-situ temperature measurement of the silicon substrate coupled to condition changes during “solvo-microwave” annealing allowed understanding of the processes to be attained. Our results suggest that the substrate has little effect on the ordering process and is essentially microwave transparent but rather, it is direct heating of the polar THF molecules that causes microphase separation. It is postulated that the rapid interaction of THF with microwaves and the resultant temperature increase to 55 °C within seconds causes an increase of the vapor pressure of the solvent from 19.8 to 70 kPa. This enriched vapor environment increases the plasticity of both PS and PLA chains and leads to the fast self-assembly kinetics. Comparing the patterns formed on silicon, germanium and silicon on insulator (SOI) and also an in situ temperature measurement of silicon in the oven confirms the significance of the solvent over the role of substrate heating during “solvo-microwave” annealing. Besides the short annealing time which has technological importance, the coherence length is on a micron scale and dewetting is not observed after annealing. The etched pattern (PLA was removed by an Ar/O2 reactive ion etch) was transferred to the underlying silicon substrate fabricating sub-20 nm silicon nanowires over large areas demonstrating that the morphology is consistent both across and through the film.
机译:微波退火是一种新兴的技术,用于在基板上实现嵌段共聚物薄膜的有序图案。人们对微波退火过程中微相分离的机理及其如何促进嵌段的微相分离了解甚少。在这里,我们在四氢呋喃(THF)溶剂的存在下使用受控功率微波辐射,以在高x层状聚苯乙烯(b-乳酸)PS-b-PLA中实现横向微相分离。在几秒钟内,在硅,锗和绝缘体上的硅(SOI)衬底上形成了高度有序的线型图。硅基板的原位温度测量与“溶剂-微波”退火过程中的条件变化相结合,可以理解要获得的工艺。我们的结果表明,底物对有序过程几乎没有影响,并且基本上是微波透明的,而是极性四氢呋喃分子的直接加热导致微相分离。假定THF与微波的快速相互作用以及所导致的温度在几秒钟内升高到55°C,会使溶剂的蒸气压从19.8增加到70 kPa。这种丰富的蒸汽环境增加了PS和PLA链的可塑性,并导致了快速的自组装动力学。比较形成在硅,锗和绝缘体上的硅(SOI)上的图形,以及烘箱中硅的原位温度测量结果,可以确认溶剂在“溶剂-微波”退火过程中的重要性超过了衬底加热的作用。除了具有技术重要性的短退火时间外,相干长度为微米级,退火后未观察到去湿现象。蚀刻后的图案(通过Ar / O2反应离子蚀刻去除了PLA)被转移到下面的硅衬底上,从而在大面积上制造了20 nm以下的硅纳米线,这表明整个膜和整个膜的形态都是一致的。

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