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Improvement in the Mechanical Properties of High Temperature Shape Memory Alloy (Ti50Ni25Pd25) by Copper Addition

机译:通过铜添加改善高温形状记忆合金(TI50NI25PD25)的机械性能

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摘要

High temperature shape memory alloys Ti50Ni25Pd25 and Ti50Ni20Pd25Cu5 were developed, characterized, and tensile tested in both martensite ( Mf − 50°C) and austenite ( Af + 50°C) phases. The transformation temperatures of ternary Ti50Ni25Pd25 alloy were increased by 11 to 12.5°C by substitution of Ni with 5 at% Cu. At the same time, transformation heat absorbed and released during forward and reverse martensitic transformation was also increased. In the martensite phase, the mechanical properties, that is, the stress for reorientation of martensite variants and fracture stress, were increased by 33 and 60 MPa, respectively, whereas the fracture strain was decreased by 1.5%. In the austenite phase, the critical stress for slip and fracture stress were increased by 62 and 40.9 MPa, respectively, whereas the fracture strain was decreased by 1.2%. The increase in both stresses was attributed to the solid solution strengthening by substitution of Ni atoms with relatively greater atomic radius of copper (Cu) atoms. The overall results suggest that the addition of 5 at% Cu in place of Ni in Ti50Ni25Pd25 alloy is very beneficial to improving the mechanical and shape memory properties and increasing the transformation temperatures.
机译:在马氏体(MF - 50℃)和奥氏体(AF + 50℃)相中,开发了高温形状记忆合金Ti50Ni25PD25和Ti50Ni20PD25Cu5,其特征和拉伸。通过用5at%Cu取代Ni,将三元Ti50Ni25pd2525合金的转化温度升高11至12.5℃。同时,在正向和反向马氏体转化期间吸收和释放的转化热也增加了。在马氏体相中,机械性能,即马氏体变体的重应力和断裂应力的应力分别增加了33和60MPa,而断裂菌株降低1.5%。在奥氏体相中,裂隙和断裂应力的临界应力分别增加了62和40.9MPa,而断裂菌株降低1.2%。这种应力的增加归因于通过取代Ni原子的固体溶液,其具有相对较大的铜(Cu)原子的原子半径。总体结果表明,在Ti50Ni25PD25合金中添加5at%Cu代替Ni,对改善机械和形状记忆性能并增加变换温度非常有益。

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