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Space Charge Behaviour and Internal Electric Field Distribution of Printed Circuit Board Insulations

机译：空间充电行为和印刷电路板绝缘的内部电场分布

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Kaori FUKUNAGA; Kenji OKAMOTO; Takashi MAENO;
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年度 2004
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1. Electrical Insulation of Conformally Coated Printed Circuit Boards: An Overview and a Study of the Influence of Pollution [J] . Zeynali Ehsan, Bridges Ryan, Kordi Behzad IEEE Electrical Insulation Magazine . 2021,第2期

机译：集合涂层印刷电路板的电绝缘：概述和污染影响的研究
2. 3-D Internal Charging Simulation on Typical Printed Circuit Board [J] . Tang X.-J., Yi Z., Meng L.-F., IEEE Transactions on Plasma Science . 2013,第12aPta2期

机译：典型印刷电路板上的3-D内部充电仿真
3. The measurement system for adjacent electromagnetic field distributions of actual IC and printed circuit board by using the 3-inputs signal phase difference measurement system and a small size sensor [J] . Satoshi Kazama 電子情報通信学会技術研究報告. 環境電磁工学. Electromagnetic Compatibility . 2001,第7期

机译：使用三输入信号相位差测量系统和小型传感器的实际IC和印刷电路板相邻电磁场分布的测量系统
4. Effects of Humidity and Temperature on Space Charge Distribution Profiles in Printed Circuit Board Insulations [C] . Yasutsune Echigo, Hidesato Tanaka, Yoshimichi Ohki, IEEE International Conference on Solid Dielectrics . 2007

机译：湿度与温度对印刷电路板绝缘空间电荷分布型材的影响
5. A fast method for computing current distribution on printed circuit boards and microwave integrated circuits using the method of moments. [D] . Jevremovic, Vladan. 1999

机译：一种使用矩量法计算印刷电路板和微波集成电路上电流分布的快速方法。
6. Defibrillation failure with an electrical short circuit caused by internal insulation breach [O] . Takuo Tsurugi, Junjiroh Koyama, Kazuhisa Kodama, 2021

机译：用内部绝缘突发引起的电气短路除颤失效
7. Special Articles: The Problem of Evaluation of Insulation Reliability for Printed Circuit Boards. Measurement Techniques of Dielectric Characteristics Suitable for Electrical Insulating Materials Used for Printed Circuit Boards and Their Application to the Estimation of Reliability on Insulation Properties. [O] . Eiki WATANABE 1995

机译：特殊文章：印刷电路板绝缘可靠性评价问题。适用于用于印刷电路板的电绝缘材料的介电特性的测量技术及其在绝缘性能估计的应用中的应用。

Space Charge Behaviour and Internal Electric Field Distribution of Printed Circuit Board Insulations

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