Hermetically Sealed Glass Package for Highly Integrated MMICs

机译：用于高度集成MMIC的密封玻璃包装

代理获取

本网站仅为用户提供外文OA文献查询和代理获取服务，本网站没有原文。下单后我们将采用程序或人工为您竭诚获取高质量的原文，但由于OA文献来源多样且变更频繁，仍可能出现获取不到、文献不完整或与标题不符等情况，如果获取不到我们将提供退款服务。请知悉。

页面导航

著录项
引文网络
相似文献
相关主题

著录项

作者
Thomas Galler; Tobias Chaloun; Kevin Krohnert; Malte Schulz-Ruhtenberg; Christian Waldschmidt;
展开▼
作者单位

展开▼
年度 2019
总页数
原文格式 PDF
正文语种
中图分类

相似文献

外文文献
中文文献
专利

1. Development of near hermetic silicon/glass cavities for packaging of integrated lithium micro batteries [J] . Krystan Marquardt, Robert Hahn, Martin Blechert, Microsystem Technologies . 2010,第7期

机译：开发用于集成锂微电池的近乎密封的硅/玻璃腔
2. Development of near hermetic silicon/glass cavities for packaging of integrated lithium micro batteries [J] . Krystan Marquardt, Robert Hahn, Martin Blechert, Microsystem technologies . 2010,第7期

机译：开发用于集成锂微电池的近乎密封的硅/玻璃腔
3. Highly-Integrated GaAs MMIC Up-Converter Available in 4 × 4 mm QFN Package [J] . Wireless design and development . 2010,第2期

机译：高度集成的GaAs MMIC上变频器，采用4×4 mm QFN封装
4. U-band MMIC low-noise amplifier module mounted in small hermetically-sealed package [C] . Uchida, Hiromitsu In: AIAA, International Communications Satellite Systems Conference and Exhibit, 17th, Yokohama, Japan, Feb. 23-27, 1998, Technical Papers (A98-18881 03-32), Reston, VA, American Institute of Aeronautics and Astronautics, Inc., 1998 . 1998

机译：小型密封封装的U波段MMIC低噪声放大器模块
5. Highly integrated three dimensional millimeter-wave passive front-end architectures using system-on-package (SOP) technologies for broadband telecommunications and multimedia/sensing applications. [D] . Lee, Jong-Hoon. 2007

机译：使用系统级封装（SOP）技术的高度集成的三维毫米波无源前端体系结构，用于宽带电信和多媒体/传感应用。
6. Hermetic Seal in Obturation: An Achievable Goal with Recently Introduced Cpoint [O] . Rani Somani, Shipra Jaidka, Deepti J Singh, 2019

机译：密闭性密封：最近引入的Cpoint是可实现的目标
7. The Investigation of Bacterial Contamination in the Foods Packaged in Hermetically Sealed Containers [O] . Kazumi HORIKAWA, Mitsuhiro HAMASAKI, Koichi MURAKAMI, 2005

机译：在密封容器包装中包装的食物中细菌污染的调查
8. Aerospace Sensor Component and Subsystem Investigation and Innovation-2 Component Exploration and Development (ASCSII-2 CED) Delivery Order 0003: Hermetically Sealed Cavities in 3-D GaAs-Silicon and Silicon-Silicon Packages for Microelectromechanical System (MEMS) Devices Using Selective and Large-Scale Bonding [R] . Malshe, A. P. 2003

机译：航空航天传感器组件和子系统调查与创新-2组件探索与开发（asCsII-2 CED）交付订单0003：采用选择性和大型的微机电系统（mEms）器件的三维Gaas硅和硅硅封装的气密密封腔 - 规模粘合

Hermetically Sealed Glass Package for Highly Integrated MMICs

著录项

引文网络

相似文献

相关主题

期刊订阅