Dielectric and Conductor-Loss Characterization and Measurements on ElectronicPackaging Materials

摘要

This is an overview of dielectric measurement methods and metrology on substratematerials used in electronic packaging. These substrates include low-temperature co-fired ceramic, high-temperature co-fired ceramic substrates, printed wiring board, and other packaging materials. The most commonly used methods are presented. We place particular emphasis on methods that can be used nondestructively either in the laboratory or on the assembly line. We begin with an overview of pertinent electrical properties of substrate materials and conductors. We then describe frequency-dependent metal losses on conductors. We also overview cavity and dielectric resonators, full-sheet resonance, coaxial probe, stripline, and capacitive methods. The frequency range of applicability and typical uncertainties associated with the methods are summarized. We also present measurement results of many substrate materials.