Lead free 0201 assembly and thermal cycle/aging reliability

机译：无铅0201装配和热循环/老化可靠性

获取原文

页面导航

摘要
著录项
相似文献
相关主题

摘要

The many challenges with 0201 passive component assembly can be attributed to the solder paste volume, pad design, aperture design, board finish, type of solder paste, pick-and-place, and reflow profile. A Design-of-Experiment (DOE) study was carried out to investigate the effects of these parameters on assembly defects and reliability.

著录项

作者
Ghaffarian, Reza; Ramkumar, S. Manian; Varanasi, Arun;
展开▼
作者单位

展开▼
年度 2005
页码 1-49
总页数 49
原文格式 PDF
正文语种 eng
中图分类工业技术;
关键词
AGING (MATERIALS); APERTURES; DEFECTS; EXPERIMENT DESIGN; LOADS (FORCES); PASTES; RELIABILITY; SOLDERS; TEMPERATURE EFFECTS; shear load; lead-free surface finish; isothermal aging; lead-free process; thermal cycle; modified apertures;

机译：老化（材料）;小孔;缺陷;实验设计;负荷（力量）;糊剂;可靠性;焊料;温度效应;剪切载荷;无铅表面处理;等温老化;无铅工艺;热循环;改良孔径;

相似文献

外文文献
中文文献
专利

1. Board-Level Solder Joint Reliability of Edge- and Corner-Bonded Lead-Free Chip Scale Package Assemblies Subjected to Thermal Cycling [J] . Hongbin Shi, Cuihua Tian, Toshitsugu Ueda Japanese journal of applied physics . 2012,第4ISSUE2期

机译：受热循环影响的边缘和角接合无铅芯片级封装组件的板级焊点可靠性
2. Lead-free 0201 manufacturing, assembly and reliability test results [J] . S. Manian Ramkumar, Reza Ghaffarian, Arun Varanasi Microelectronics & Reliability . 2006,第2a4期

机译：无铅0201的制造，组装和可靠性测试结果
3. Thermal Aging Effects on the Thermal Cycling Reliability of Lead-Free Fine Pitch Packages [J] . Zhang, J., Hai, Components, Packaging and Manufacturing Technology, IEEE Transactions on . 2013,第8期

机译：热老化对无铅细间距封装热循环可靠性的影响
4. Lead Free 0201 Assembly and Thermal Cycle/Aging Reliability [C] . Reza Ghaffarian, S. Manian Ramkumar, Arun Varanasi IPC Printed Circuits Expo, Apex, and the Designers Summit vol.1; 20060205-10; Anaheim,CA(US) . 2006

机译：无铅0201组装和热循环/老化可靠性
5. Microstructural changes under isothermal aging and their influence on thermal fatigue reliability for tin-lead and lead-free solder joints, including microstructural changes under isothermal aging in mixed solder joints [D] . Choubey, Anupam 2007

机译：锡铅和无铅焊点在等温老化下的微观结构变化及其对热疲劳可靠性的影响，包括混合焊点在等温老化下的微观结构变化
6. Effect of Wafer Level Underfill on the Microbump Reliability of Ultrathin-Chip Stacking Type 3D-IC Assembly during Thermal Cycling Tests [O] . Chang-Chun Lee 2017

机译：晶圆级底部填充对热循环测试过程中超薄芯片堆叠式3D-IC组件微凸点可靠性的影响
7. THERMAL CYCLING RELIABILITY OF LEAD-FREE SOLDERS (SAC305 AND SN3.5AG) FOR HIGH TEMPERATURE APPLICATIONS [O] . George, Elviz 2010

机译：高温应用无铅焊料（SAC305和SN3.5AG）的热循环可靠性
8. Lead-Free vs Tin-Lead Reliability of Advanced Electronic Assemblies [R] . Ghaffarian, Reza 2005

机译：先进电子组件的无铅与锡铅可靠性

Lead free 0201 assembly and thermal cycle/aging reliability

摘要

著录项

相似文献

相关主题

期刊订阅