Thermal Aging Effects on the Thermal Cycling Reliability of Lead-Free Fine Pitch Packages

摘要

The microstructure, mechanical response, and failure behavior of lead-free solder joints in electronic assemblies are constantly evolving when exposed to isothermal aging and/or thermal cycling environments. A direct and deleterious effect on packaging reliability has been observed during elevated temperature isothermal aging for fine-pitch ball grid array (BGA) packages with Sn-1.0Ag-0.5Cu (SAC105), Sn-3.0Ag-0.5Cu (SAC305), and Sn-37Pb solder ball interconnects. Package sizes range from 19 mm with 0.8-mm pitch BGAs to 5 mm with 0.4-mm pitch BGAs with three different board finishes (ImSn, ImAg, and SnPb) previously studied. This paper presents the latest results from an on-going investigation on the aging temperatures were 25$^{circ}{rm C}$, 55 $^{circ}{rm C}$, 85$^{circ}{rm C}$, and 125$^{circ}{rm C}$, applied for a period of 12 months. Subsequently, the specimens were thermally cycled from ${-}{rm 40}^{circ}{rm C}$ to 125$^{circ}{rm C}$ with 15 min dwell times at the high temperature. Weibull analysis of failures versus cycle number show a ${sim}{57%}$ reduction in package lifetimes when aged at 125 $^{circ}{rm C}$ compared to no aging for 19 mm BGAs, for MLFs the degradation is even worse, more than 58% reduction in experiment result. In contrast, the reliability performance of Sn-37Pb is much more stable over long time up to 12 months and temperature. We also study the evolution during isothermal aging, which is one of the ma- or failure modes of solder joints due to its high homologous temperature. The degradation is observed for both SAC alloys on all tested package sizes and board finishes. For the 19 mm SAC105 case, e.g., there was a 53% (57%) reduction of characteristic lifetime at 125$^{circ}{rm C}$ for 6 months (12 months) compared to room temperature aging. The trends are in the expected directions; namely, the reliability is reduced when using higher aging temperatures, smaller solder balls, and SAC105. The dominant failure mode can be associated with the growth of ${rm Cu}_{6}{rm Sn}_{5}$ intermetallic compounds during the aging, particularly on the pad side.