Thermal Stress Analysis of Space Shuttle Orbiter Wing Skin Panel and Thermal Protection System.

摘要

Preflight thermal stress analysis of the space shuttle orbiter wing skin panel and the thermal protection system (TPS) was performed. The heated skin panel analyzed was rectangular in shape and contained a small square cool region at its center. The wing skin immediately outside the cool region was found to be close to the state of elastic instability in the chordwise direction based on the conservative temperature distribution. The wing skin was found to be quite stable in the spanwise direction. The potential wing skin thermal instability was not severe enough to tear apart the strain isolation pad (SIP) layer. Also, the preflight thermal stress analysis was performed on the TPS tile under the most severe temperature gradient during the simulated reentry heating. The tensile thermal stress induced in the TPS tile was found to be much lower than the tensile strength of the TPS material. The thermal bending of the TPS tile was not severe enough to cause tearing of the SIP layer.