Effect of melt-solid interface shape on lateral compositional distribution of unidirectionally solidified 2-6 semiconducting alloys

摘要

A computer code developed previously has been used to simulate lateral compositional distributions for several 2-6 semiconducting systems. The code is based on analytical results obtained previously. The system under study is an azimuthal symmetric cylindrical system with a curved melt-solid interface shape during an unidirectional solidification process. It is assumed that the system is under a steady state diffusion limited growth condition.