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Morphologies of Solid-Liquid Interface and Redistribution of Solutes in Unidirectionally Solidified Copper and Copper-base Alloys

机译：固体液体界面的形态学和单向凝固铜和铜基合金中的溶质再分配

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Kosaku Nakano; Yasunobu Kobayashi; Akihiko Kamio; Shigeo Oya;
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年度 1976
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1. Effect of Ce on solute redistribution in liquid ahead of solid-liquid interface during solidification of Fe-4 wt.％Si alloy [J] . Yun-ping Ji, Ming-xing Zhang, Yuan Hou, 钢铁研究学报（英文版） . 2021,第010期

机译：Ce对Fe-4重量凝固过程中液体界面溶液在液体前溶质再分配的影响。％Si合金
2. Analytical modeling of solute redistribution during the initial unsteady unidirectional solidification of binary dilute alloys: comparison with experiments [J] . Laurentiu Nastac Scripta materialia . 1998,第7期

机译：二元稀合金初始非稳态单向凝固过程中溶质再分布的解析模型：与实验比较
3. THE　STABILITY　OF　SOLID－LIQUID　INTERFACE　OF　UNIDIRECTIONAL　SOLIDIFIED　Fe－C　EUTECTIC　ALLOY [J] . 蒋建清东南大学学报：英文版 . 1994,第001期

机译：单向凝固Fe-C共晶合金固体液体界面的稳定性
4. Solute Redistribution, Liquid/Solid Interface Instability, and Initial Transient Regions during the Unidirectional Solidification of Ti-6-4 and Ti-17 Alloys [C] . Laurentiu Nastac TMS annual meeting exhibition;Symposium on CFD modeling and simulation in materials processing . 2012

机译：Ti-6-4和Ti-17合金单向凝固过程中的溶质再分布，液/固界面不稳定性和初始瞬态区
5. PRECIPITATION AND COARSENING BEHAVIOR IN TWO COPPER-BASE ALLOYS: COPPER-TITANIA, COPPER-CHROMIUM [D] . GUHA, AMITAVA. -1

机译：两种铜基合金的析出和粗化行为：铜-钛，铜-铬
6. Investigation of the Mechanical Properties of Mn-Alloyed Tin-Silver-Copper Solder Solidified with Different Cooling Rates [O] . Tamás Hurtony, Oliver Krammer, Balázs Illés, 2020

机译：用不同冷却率固化Mn合金锡 - 银铜焊料力学性能的研究
7. Effect of Sulphur on the Solid-Liquid Interface Morphology of Unidirectionally Solidified Fe-C Eutectic Alloys [O] . Eiichi Kondoh, Hideo Nakae 1991

机译：硫对单向凝固Fe-C共晶合金的固液界面形态的影响
8. Copper-Base Alloys Processed by Rapid Solidification and Ion Implantation [R] . Wood, J. V., Elvidge, C. J., Johnson, E., 1985

机译：快速凝固和离子注入处理铜基合金

Morphologies of Solid-Liquid Interface and Redistribution of Solutes in Unidirectionally Solidified Copper and Copper-base Alloys

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