High-performance GaAs/AlGaAs optical modulators: Their performance and packaging for microwave photonic integrated circuits

摘要

The goal of this effort is to build and package photonic integrated circuits (PICs). This infers that compact device design is very important, with all building blocks of the circuit aimed toward integration, low voltage operation, and manufacturability. With such a device, it is important that optical packaging be considered in the initial design. To this end, an advanced photonic packaging concept was designed. This concept employs vertical coupling of light both in and out of the package. This package concept is aimed at hermeticity, with no fiber penetrations through the walls of the package. This paper will describe the building blocks of this package, including output gratings, binary optics, and an automatic fiber capture device, called CLASP.