Electrically conductive adhesive Flip Chip Attach Project. Annual report, October 1, 1994--October 1, 1995

摘要

This annual report details activities for TRP Flip Chip Attached Project. The IBM/Universal Instruments team has completed the first year effort on the Electrically Conductive Adhesive Flip Chip Attach project. IBM-Yorktown has worked closely with IBM Endicott to develop a Polymer Metal Solvent Paste (PMSP) that can be processed to form a cylindrically shaped deposit. IBM Endicott has done extensive work on bonding. This work has identified the key parameters to bond a Polymer Metal Composite (PMC) bumped die to a substrate.