Selected Physical and Thermal Properties of Various Formulations of Silicone Potting Compounds

摘要

Some of the physical and thermal properties are presented of materials developed as substitutes for additional cured silicone potting compounds which are no longer produced by Dow Corning. The six raw materials tested were: Sylgard 186; Sylgard 184; Q3-6527 Dielectric Gel; Q3-6559 Accelerator; DC-1107; and Cabosil MS-75. Test data are reported for: disk or punch shear strength; lap shear strength; butt tensile strength; compressive strength; bulk tensile strength; durometer hardness; dynamic shear modulus; density; crosslink density; coefficient of thermal expansion; thermal conductivity; specific heat; and thermal diffusivity. All samples were prepared and cured at 25 exp 0 C. Unless otherwise stated, all samples were tested at 25 exp 0 C after a minimum cure time of 30 days. (ERA citation 06:005109)